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  • Lead-free solder wire SnCu0.7
      • Lead-free solder wire SnCu0.7
      • Lead-free solder wire SnCu0.7
      • Lead-free solder wire SnCu0.7
      • Lead-free solder wire SnCu0.7

    ◎ SnCu0.7 lead-free solder wire chemical composition% GB/T20422-2006

    Sn

    Ag

    Cu

    Sb

    Bi

    Ni

    Zn

    Al

    As

    Additive

    Margin

    く0.01

    0.5-0.9

    く0.03

    く0.05

    く0.001

    く0.003

    く0.001

    く0.001

    0-1

    ◎The main physical properties of lead-free solder SnCu0.7 and applicable technology

    Melting temperature (℃)

    Brazing head strength (б/MPa)

    Resistivity (ρ/Ω.m.)

    Application process

    227 E

    18.8

    0.127

    Wave soldering, hand soldering, tin lining

    The lead-free solder is a tin-copper-based binary alloy solder, solder this section has been in the industry for many years, the performance has been achieved recognition in welding better wetting and brazing strength, its lead content pole low, can be achieved 100PPm.


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