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◎ SnCu0.7 lead-free solder wire chemical composition% GB/T20422-2006
Sn | Ag | Cu | Sb | Bi | Ni | Zn | Al | As | Additive |
Margin | く0.01 | 0.5-0.9 | く0.03 | く0.05 | く0.001 | く0.003 | く0.001 | く0.001 | 0-1 |
◎The main physical properties of lead-free solder SnCu0.7 and applicable technology
Melting temperature (℃) | Brazing head strength (б/MPa) | Resistivity (ρ/Ω.m.) | Application process |
227 E | 18.8 | 0.127 | Wave soldering, hand soldering, tin lining |
The lead-free solder is a tin-copper-based binary alloy solder, solder this section has been in the industry for many years, the performance has been achieved recognition in welding better wetting and brazing strength, its lead content pole low, can be achieved 100PPm.
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Lead-free solder wire
