◎ SAC305 lead-free solder wire chemical composition% GB/T20422-2006
Model | Sn | Ag | Cu | Sb | Bi | Ni | Zn | Al | As | Additive |
JL-S305 | Margin | 2.8-3.0 | 0.5-0.9 | 0.10 | 0.10 | 0.01 | 0.001 | 0.001 | 0.03 | 0~2 |
The main physical properties ◎ SAC305 lead-free solder
Type | Melting temperature ℃ | Tensile strength /MPa | Resistivity µΩ.cm | Elongation % | Density g/cmᵌ |
JL-S305 | 217--219 | 45 | 12 | 22.25 | 7.37 |
I produced SAC305 lead-free solder wire with a purity of Yunnan Tin Tin, 1 # electrolytic silver raw material, with high-tech flux produced. Its uniform composition, microstructure fine, wetting time is short, good weldability; bright spot, round; reliable and low spatter, low smoke and so on. Has been widely used in electronics, instrumentation, aerospace and other industries for the production of high-precision products.