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  • SnAg3.0Cu0.5 (SAC305) Lead-free solder wire
      • SnAg3.0Cu0.5 (SAC305) Lead-free solder wire
      • SnAg3.0Cu0.5 (SAC305) Lead-free solder wire
      • SnAg3.0Cu0.5 (SAC305) Lead-free solder wire
      • SnAg3.0Cu0.5 (SAC305) Lead-free solder wire

    ◎ SAC305 lead-free solder wire chemical composition% GB/T20422-2006

    Model

    Sn

    Ag

    Cu

    Sb

    Bi

    Ni

    Zn

    Al

    As

    Additive

    JL-S305

    Margin

    2.8-3.0

    0.5-0.9

    0.10

    0.10

    0.01

    0.001

    0.001

    0.03

    0~2

    The main physical properties ◎ SAC305 lead-free solder

    Type

    Melting temperature ℃

    Tensile strength /MPa

    Resistivity µΩ.cm

    Elongation %

    Density g/cmᵌ

    JL-S305

    217--219

    45

    12

    22.25

    7.37

    I produced SAC305 lead-free solder wire with a purity of Yunnan Tin Tin, 1 # electrolytic silver raw material, with high-tech flux produced. Its uniform composition, microstructure fine, wetting time is short, good weldability; bright spot, round; reliable and low spatter, low smoke and so on. Has been widely used in electronics, instrumentation, aerospace and other industries for the production of high-precision products.


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