◎ SnAg0.3 free solder wire chemical composition% GB/T20422-2006
Sn | Ag | Cu | Sb | Bi | Ni | Zn | Al | As | Additive |
Margin | 0.3 | く0.01 | く0.03 | く0.05 | く0.001 | く0.003 | く0.001 | く0.001 | 0-0.5 |
◎The main physical properties of lead-free solder SnAg0.3
Solid - liquid line temperature (℃) | Density (g/cm3) | Tensile strength (MPa) | Elongation (%) | Yield Strength (MPa) |
221-229 | 7.5 | 26.7 | 24 | 22.5 |
The lead-free solder is a tin-silver-based binary alloy solder, performance has been achieved recognition in welding better wetting and brazing strength, its very low lead levels can reach 100PPM less. This product has a solid wire and flux cored two models, because the lead-free solder wire-free copper (Cu), in fact, the heart can be used for automatic wire welding wire added (when automatic welding machine tin bath alloy material is SnAg0.3Cuo.7 time), to reduce the copper content increases the impact of the welding quality.