◎SnCu4.0 without Tin Chemical composition% GB/T20422-2006
Sn | Ag | Cu | Sb | Bi | Ni | Zn | Al | As | Additive |
Margin | く 0.003 | 4.0-4.5 | く0.03 | く0.05 | く0.001 | く0.003 | く0.001 | く0.001 | 0-2 |
◎SnCu4.0 main physical properties of lead-free solder and applicable technology
Melting temperature℃ | Brazing head strength (б/MPa) | Resistivity ρ/Ω.m.10-6 | Application process |
238-247 | 20.8 | 0.102 | Electronic components, the lining of tin |
Which free solder is designed for high-temperature lining of tin and lead the development of electronic components, which can be a long time in high temperature operation (operating temperature for a long time to set about 4000C-4500C), tin cylinder surface is bright white mirror, less oxidation, light welding performance, smooth without bumps and black spots appear while being able to meet and special resin-based lead-free no-clean solder flux requirements. Especially suitable for the lining of tin wire autolysis process manufacturing transformer manufacturing industry. ◎ available product specifications (type casting, extrusion-type)
Standard Products: Casting tin: 0.6KG / root, squeezing tin: 0.5Kg / root
Non-standard products: Depending on user requirements
◎ Package:
Solder: 20KG / box or packaging according to the agreement;
Stored in a cool, ventilated, dry place.