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  • SnCu4.0 without Tin
      • SnCu4.0 without Tin
      • SnCu4.0 without Tin
      • SnCu4.0 without Tin
      • SnCu4.0 without Tin
      • SnCu4.0 without Tin

    ◎SnCu4.0 without Tin Chemical composition% GB/T20422-2006

    Sn

    Ag

    Cu

    Sb

    Bi

    Ni

    Zn

    Al

    As

    Additive

    Margin

    く 0.003

    4.0-4.5

    く0.03

    く0.05

    く0.001

    く0.003

    く0.001

    く0.001

    0-2

    ◎SnCu4.0 main physical properties of lead-free solder and applicable technology

    Melting temperature℃

    Brazing head strength (б/MPa)

    Resistivity ρ/Ω.m.10-6

    Application process

    238-247

    20.8

    0.102

    Electronic components, the lining of tin

    Which free solder is designed for high-temperature lining of tin and lead the development of electronic components, which can be a long time in high temperature operation (operating temperature for a long time to set about 4000C-4500C), tin cylinder surface is bright white mirror, less oxidation, light welding performance, smooth without bumps and black spots appear while being able to meet and special resin-based lead-free no-clean solder flux requirements. Especially suitable for the lining of tin wire autolysis process manufacturing transformer manufacturing industry. ◎ available product specifications (type casting, extrusion-type)
    Standard Products: Casting tin: 0.6KG / root, squeezing tin: 0.5Kg / root
    Non-standard products: Depending on user requirements

    ◎ Package:
    Solder: 20KG / box or packaging according to the agreement;
    Stored in a cool, ventilated, dry place.


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