Changzhou Friend Lead-free Solder Metal Co., Ltd.

SnAg0.3Cu0.7 (SAC0307) without Tin

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◎SnAg0.3Cu0.7 without Tin Chemical composition% GB/T20422-2006

Sn	Ag	Cu	Sb	Bi	Ni	Zn	Al	As	Additive
Margin	0.3	0.5-0.9	く0.03	く0.05	く0.001	く0.003	く0.001	く0.001	0-2

◎SAC0307 main physical properties of lead-free solder

Melting temperature	Tensile strength /MPa	Resistivity μΩ.cm	Application process
217-225	40	12.9	Wave soldering, hand soldering, tin lining

SnAg0.3Cu0.7 free solder is lead-free soldering materials of low silver ternary alloy of the lead-free solder has good wetting, bright solder joints, anti-oxidation good performance, good overall performance characteristics of joints, has widely used in electronics, instrumentation, aerospace, home appliances wave soldering, dip soldering PCB assembly and lining tin process.

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