Changzhou Friend Lead-free Solder Metal Co., Ltd.

SnAg0.3 without Tin

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◎SnAg0.3 without Tin chemical composition GB/T20422-2006

Sn	Ag	Cu	Sb	Bi	Ni	Zn	Al	As	Additive
Margin	0.3	く 0.01	く0.03	く0.05	く0.001	く0.003	く0.001	く0.001	0-0.5

◎SnAg0.3 main physical properties of lead-free solder

Solid - liquid line temperature ℃	Densityg /cm³	Tensile strength /MPa	Elongation %	Yield Strength /MPa
221-229	7.5	26.7	24	22.5

SnAg0.3 free solder bar with good silver, tin and conductivity wettability and added antioxidants, the lead-free solder is a tin-silver binary alloy lead-free solder, the performance has been achieved recognition in welding when there is a good wetting and brazing strength, as SnAg0.3Cu0.7 lead-free solder wave soldering process furnace lining of tin added jobs (the product does not contain copper Cu).

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