◎SnAg0.3 without Tin chemical composition GB/T20422-2006
◎SnAg0.3 main physical properties of lead-free solder
Solid - liquid line temperature ℃
Tensile strength /MPa
Yield Strength /MPa
SnAg0.3 free solder bar with good silver, tin and conductivity wettability and added antioxidants, the lead-free solder is a tin-silver binary alloy lead-free solder, the performance has been achieved recognition in welding when there is a good wetting and brazing strength, as SnAg0.3Cu0.7 lead-free solder wave soldering process furnace lining of tin added jobs (the product does not contain copper Cu).