◎SnCu0.7 without Tin Chemical composition% GB/T20422-2006
◎The main physical properties of lead-free solder SnCu0.7 and applicable technology
Brazing head strength (б/MPa)
Wave soldering, hot-dip tin
Sn Cu0.7 without Tin is Copper-based binary alloy of tin lead-free solder，This section of the solder has been applied for many years in the industry, the performance has been achieved recognition. Our high purity raw materials and refined through the use of technology and the introduction of high antioxidant elements, better wetting and brazing strength in welding and slag less. Widely used in wave soldering, hot dip soldering electronic products welding process. The products are divided into high-temperature oxidation, low temperature anti-oxidation two products for customers to choose.
◎Available product specifications (type casting, extrusion-type)
Standard Products: tin: 0.5KG / root
Non-standard products: Depending on user requirements
Solder: 20kg / box; 25kg / box
Stored in a cool, ventilated, dry place.