SAC305 lead-free solder of the chemical composition of GB/T20422-2006
Melting temperature ℃
Chemical composition (mass fraction)%
* I plant SAC305 Pb-free solder of content is lower than the national standards
JL-SAC305 is tin-silver-copper ternary alloy solder, designed for lead-free solder paragraph electronics assembly design and development, including common standards for the silver content of 3.0% copper content of 0.5% (Sn-3.0 Ag-0.5Cu); subsection applicable to lead-free solder wave soldering, welding and soldering iron hand SMT surface mount, etc., in the welding process can be demonstrated between good wettability of copper-tin solder joint strength high, especially in terms of creep fatigue properties after welding, but showing the reach of the general superiority of the solder.