◎SnAg0.3 without Tin chemical composition GB/T20422-2006
Sn | Ag | Cu | Sb | Bi | Ni | Zn | Al | As | Additive |
Margin | 0.3 | く 0.01 | く0.03 | く0.05 | く0.001 | く0.003 | く0.001 | く0.001 | 0-0.5 |
◎SnAg0.3 main physical properties of lead-free solder
Solid - liquid line temperature ℃ | Densityg /cm3 | Tensile strength /MPa | Elongation % | Yield Strength /MPa |
221-229 | 7.5 | 26.7 | 24 | 22.5 |
SnAg0.3 free solder bar with good silver, tin and conductivity wettability and added antioxidants, the lead-free solder is a tin-silver binary alloy lead-free solder, the performance has been achieved recognition in welding when there is a good wetting and brazing strength, as SnAg0.3Cu0.7 lead-free solder wave soldering process furnace lining of tin added jobs (the product does not contain copper Cu).