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  • Sn3.0Ag0.5Cu NP-01-type lead-free solder paste
      • Sn3.0Ag0.5Cu NP-01-type lead-free solder paste

    1. Overview
    NP-01 type SAC305 lead-free solder paste suitable for mounting with lead-free solder reflow SMT assembly process. Its composition is determined by Sn3.0Ag0.5Cu metal powders, adhesives, solvents, fluxes, thixotropic agents careful deployment. This type of solder paste, weldability strong residue light color, medium viscosity, high insulation resistance, has good technology applicability and so on.

    2. The alloy composition
    SAC305 solder paste using high quality spherical powder, the ingredients in the following table:

    The main ingredient %

    Impurities% (not more than)

    Sn

    Ag

    Cu

    Pb

    Sb

    Bi

    Zn

    Fe

    Al

    As

    Cd

    Margin

    0.3±0.2

    0.7±0.05

    0.05

    0.12

    0.10

    0.002

    0.02

    0.002

    0.03

    0.002

    3. Technical indicators

    Model

    NP-01 type

    Solder paste melting temperature ℃

    217-219

    Solder particle size μm

    25-45 μm, etc.; different particle size can be selected according to user needs

    Flux content%

    10-12

    Halogen content%

    0

    Expansion Rate%

    >85

    Viscosity Pa.S

    160-200

    Insulation resistance Ω

    >1X1011

    Copper Mirror Test

    Qualified (no penetration)

    Water soluble resistance Ω

    >5X104

    Electromigration test

    No

    Note: The test methods based on: JIS Z 3197 ~ 3284.

    4. The use and printing conditions
    a. Paste return temperature: cold solder before use should be restored to the studio temperature, the usual time takes 3 to 6 hours.
    b. Stir paste: paste back to the studio after the temperature, stirred before use to use stainless steel rods, the time recommended two minutes or more.
    c. Printing: stainless steel stencil / screen printing / Point Note.
    d. Printing speed: recommended 25-60mm / S, depending on the specific conditions set.
    e. Component placement: It is recommended within four hours, depending on the component specifications and other conditions set.
    f. Tack retention time: 8 hours, depending on the specific circumstances set.
    g. Working environment: no vibration, the ideal temperature 20-25 ℃, relative humidity of 50-70%

    5. Storage and packaging:
    a. Storage: storage time should not exceed six months, and sealed refrigeration at 0-10 ℃ space, to avoid direct sunlight and high temperatures.
    b. Packaging:
     1) Weight: 500 g / jar (net weight)
     2) Color: green plastic pot
     3) Tag: a. Name, b. Model, c. Alloy composition, d. Date of manufacture e. Validity, f. Flux content, g. Operating Precautions, h. Unleaded logo


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