◎Features and Scope:
JL-F9001 low solids no-clean lead-free electronics assembly flux of lead-free soldering process technology dedicated, able to adapt to the higher temperature lead-free soldering requirements. Its appearance is colorless transparent liquid. This product is environmentally friendly, suitable for spray foam or wave soldering, solder, soldering iron is not recommended for manual welding. This product is welded, clean the board after soldering, less residue, spot light, non-corrosive, for high-quality HASL PCB is very suitable, also apply to the shelf life of bare copper welding.
◎ main ingredients: alcohol solvent, surfactant, co-solvent, stabilizer
◎ Storage: flammable and should be stored in airtight away from the fire, dry and ventilated place, storage temperature should not exceed 400C.
◎ Packing: 20 l plastic bucket or other agreed means.
JL-F9001 series of lead-free flux technical specifications
Flux Model | JL-F9001 |
Joint Appearance | Bright |
Solid ingredients % | 4.5±0.5 |
Appearance | Uniform liquid |
Liquid Color | Colorless |
Specific gravity g/ml | 0.830± 0.005 |
Boiling Point ℃ | 83.0± 2.0 |
Acid valueKOH.mg/g | 21.50 ±5.00 |
Diffusion resistance % | 90 % |
Halogen content % | 0 |
Use Thinner | JL-T900 |
Insulation ResistanceΩ | ≥1*10″ |
Corrosion Test | pass |
Application process | Foaming dipping, spraying |
Immersion tin time s | 2-4 |
Preheating temperature ℃ | 100-130 |
Solder temperature ℃ | 265-275 |
Activation temperature range and schematic
First, an appropriate preheating temperature activation range: 900C-1200C;
Second, the activation temperature range appropriate welding: 2500C-2700C.