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  •   Home > Products > Flux
    JL-F9001
      • JL-F9001

    Features and Scope:
    JL-F9001 low solids no-clean lead-free electronics assembly flux of lead-free soldering process technology dedicated, able to adapt to the higher temperature lead-free soldering requirements. Its appearance is colorless transparent liquid. This product is environmentally friendly, suitable for spray foam or wave soldering, solder, soldering iron is not recommended for manual welding. This product is welded, clean the board after soldering, less residue, spot light, non-corrosive, for high-quality HASL PCB is very suitable, also apply to the shelf life of bare copper welding.

    main ingredients: alcohol solvent, surfactant, co-solvent, stabilizer

    Storage: flammable and should be stored in airtight away from the fire, dry and ventilated place, storage temperature should not exceed 400C.

    Packing: 20 l plastic bucket or other agreed means.

    JL-F9001 series of lead-free flux technical specifications

    Flux Model

    JL-F9001

    Joint Appearance

    Bright

    Solid ingredients %

    4.5±0.5

    Appearance

    Uniform liquid

    Liquid Color

    Colorless

    Specific gravity g/ml

    0.830± 0.005

    Boiling Point ℃

    83.0± 2.0

    Acid valueKOH.mg/g

    21.50 ±5.00

    Diffusion resistance %

    90 %

    Halogen content %

    0

    Use Thinner

    JL-T900

    Insulation ResistanceΩ

    ≥1*10″

    Corrosion Test

    pass

    Application process

    Foaming dipping, spraying

    Immersion tin time s

    2-4

    Preheating temperature ℃

    100-130

    Solder temperature ℃

    265-275

    Activation temperature range and schematic

    First, an appropriate preheating temperature activation range: 900C-1200C;

    Second, the activation temperature range appropriate welding: 2500C-2700C.


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