JL-F820 series of products with high quality, transparent and refined rosin with a variety of organic activators careful blend of wetting during welding performance, effectively reducing the surface tension of molten tin, and can maintain its unique in the welding area activity, reduce the occurrence of weld defects; dry quickly after welding, will not cause the surface sticky, easy to follow treatment process after welding; non-corrosive, has a very high surface insulation resistance, widely used in electronics, instrumentation, home electrical and other industries.

This series of product performance and technical indicators have been tested by the national electronic industry materials for Quality Supervision and Inspection Center.

◎Product Features:
* Liquid resin flux, the appearance of brown and brown-red, high solid content.
* Especially suitable for spray foam wave soldering and dip soldering.
* Board after soldering residues transparent film, board dry, non-sticky, non-corrosive, high insulation resistance.
* When welding spatter, good activity, low odor, low smoke, meet environmental requirements.
* Board after welding residual light in color, residual and easy to clean.
* Free cleaning after soldering can reach the standard (cleaning is recommended to use my company JL-C700 series of cleaning agents).
* Suitable for all kinds of circuit board soldering tin and lead pin boring process.

◎ conditions of use:
1. wave soldering tin stove suggestions parameters:
* Preheat temperature: 900C-1100C (the actual board temperature); * tin furnace temperature: 2450C +50 C.
* Sent to board speed :1.1-1 .2M/Min; air knife angle :100-450; * dip :5.0-6 .5 degrees.

2. the manual recommends dip tin furnace parameters:
* The board lightly dipped in flux or solder component surface dipped in a little, the net flow advection, it is best to have a closed hot preheated, immersed in the tin bath for 3-5 seconds.
* Tin furnace temperature: 2450C-2500C
* The dip soldering furnace should have ventilation.

As for the foaming device, our sales engineers and technical staff will assist to give guidance, pore foaming should be 0.02MM less than the flux surface foam rods 1 inch or more.

◎ Notes：
* Air Knife and reasonable adjustments on PCB soldering temperature adhesive tape type and firmness to prevent fire hazards when welding or preheat.
* Strictly prohibited and other flux, thinner mix.
* If the foam for dip soldering and wave soldering, adding diluent Please accept our sales engineers recommended guidance, correctly grasp the degree of acid number and proportion of flux, flux after 48 hours of continuous use, the proposed replacement of the flux.
* For severe oxidative board or leads, pins, available in the series flux welding or processing, post-processing applications for the cleaning agent to clean the new welding.

◎ Storage: This product is flammable and should be stored in airtight away from the fire, dry and ventilated place, storage temperature should not exceed 400C.

◎ Packing: 20 liters, 200 liters plastic bucket or other agreed means.